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</html><description>[vc_row][vc_column][vc_column_text] [/vc_column_text][/vc_column][/vc_row][vc_row][vc_column width=&#x201D;1/4&#x2033;][vc_wp_custommenu nav_menu=&#x201D;10&#x2033; el_class=&#x201D;tssidemenu&#x201D;][/vc_column][vc_column width=&#x201D;3/4&#x2033;][vc_single_image image=&#x201D;791&#x2033; img_size=&#x201D;full&#x201D; css=&#x201D;&#x201D; el_class=&#x201D;kroundend&#x201D;][vc_column_text css=&#x201D;&#x201D;] Advancements in aviation technology have significantly increased the number and density of electronic components used in aircraft. These components generate heat as they continuously consume electrical power during flight. In order for these onboard electronic systems to maintain reliability and performance, they must operate within specific temperature ranges. Thermal control systems are designed to maintain balanced semiconductor junction temperatures of equipment, ensure the required cooling flow rates, and preserve optimal operating temperatures. Solutions developed through TASECS engineering classify these systems into two main categories based on the cooling medium:Air-Cooled [&hellip;]</description></oembed>
